• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A single lead frame package is disclosed having a coupling induction coil and an integrated circuit semiconductor chip. The lead frame is preferably made of a copper alloy and has a flat structure. The chip is electrically connected to the end of the induction coil, whereby the induction coil functions as an antenna for the chip.
    公开号:KR19990029974A
    申请号:KR1019980038909
    申请日:1998-09-15
    公开日:1999-04-26
    发明作者:죠셉 페르난데즈；리 퓨레이
    申请人:마이크로칩 테크날러쥐 인코포레이티드；
    IPC主号:
    专利说明:

    A single lead frame package having a coupling induction coil and an integrated circuit semiconductor chip and a method of manufacturing the same
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to the use of passive elements in semiconductor devices, and more particularly, to a single lead frame package having a coupling induction coil and an integrated circuit semiconductor chip and a method of manufacturing the same.
    In the past, passive devices such as inductors, capacitors and resistors have been combined with active devices such as diodes and transistors on printed substrates to manufacture electronic circuits and / or electronic systems.
    As technology has advanced, various types of active devices, such as bipolar and MOS (or unipolar) devices, have been integrated into a single semiconductor chip. The integration of these active elements with passive elements such as resistors and capacitors form an electrical circuit known as an integrated circuit semiconductor chip within a single semiconductor chip.
    The package of the integrated circuit semiconductor chip has become very important. Accordingly, integrated circuit semiconductor chip manufacturers have been seeking to obtain a method of packaging an integrated circuit semiconductor chip at low cost and with reliability.
    One package technology is to provide a ceramic package with a metal pin that enables the ceramic package to be inserted through a hole in a printed circuit board comprising a plurality of ceramic packages connected to each other to provide an electronic circuit or electronic system. It is a general purpose to provide a hybrid package integrating integrated circuit semiconductor chips and passive devices on a ceramic substrate surface. Ceramic packages are very expensive and eventually printed circuit boards that use multiple ceramic packages are also expensive.
    In an effort to significantly reduce manufacturing costs, lead frame packages have been developed to accommodate and protect integrated circuit semiconductor chips. The lead frame package generally includes a metal lead frame member for receiving an integrated circuit semiconductor chip over a portion of the lead frame package. Wirebonding technology is used to electrically connect the terminal portion or pad of the integrated circuit semiconductor chip to the fingers of the lead frame structure. The integrated circuit semiconductor chip on the wirebonded lead frame structure is then encapsulated in plastic to provide a plastic capsule lead frame package. In terms of manufacturing costs, plastic capsule lead frame packages are very inexpensive compared to, for example, ceramic type packages.
    There is a need to develop electronic type products that can be manufactured at relatively low cost using lead frame manufacturing technology. There is a need for improved lead frame type products that can perform functions not provided by particularly useful lead frame products.
    It is therefore an object of the present invention to provide an improved lead frame package and a method of manufacturing the same.
    It is another object of the present invention to provide an improved lead frame package and a method of manufacturing the same that combine an integrated circuit semiconductor chip with a passive element in a single lead frame package.
    It is yet another object of the present invention to provide an improved lead frame package and method for fabricating the integrated circuit semiconductor chip and inductor in a single lead frame package.
    It is yet another object of the present invention to provide an improved lead frame package and method of manufacturing the same, incorporating an induction coil and an integrated circuit semiconductor chip as a transmitter in a single lead frame package.
    It is still another object of the present invention to provide an improved lead frame package and a method of manufacturing the same, which combine an integrated circuit semiconductor chip as a receiver and an induction coil as an antenna for a receiver in a single lead frame package.
    1 illustrates an integrated circuit semiconductor chip mounted on a portion of a single lead frame plastic capsule package and electrically connected to both ends of an induction coil away from the chip and comprising a substantial portion of the lead frame of the package. Section of single lead frame plastic capsule package.
    FIG. 2 is mounted over a corner portion of an induction coil that includes a substantial portion of the package lead frame and is electrically connected to both ends of the induction coil, although dielectrically insulated from the induction coil portion located directly below the chip. Cross-sectional view of another embodiment of a single leadframe plastic capsule package of the present invention showing an integrated circuit semiconductor chip.
    Explanation of symbols for the main parts of the drawings
    10: package 12: plastic capsule cover
    14 induction coil 16 connection member
    18: die attach paddle 20: vertical connection bar member
    22: horizontal connecting bar member 24: semiconductor chip
    26, 28: terminal pad 34, 36: wire bond
    According to a first embodiment of the present invention, there is provided a single lead frame package having a combination of an induction coil and an integrated circuit semiconductor chip, comprising: a single package; A lead frame located in a single package and having a coil structure and positioned in one horizontal plane; And an integrated circuit semiconductor chip located in a single package and coupled to the lead frame and having at least one terminal pad electrically connected to at least a portion of the coil structure of the lead frame. Preferably, the integrated circuit semiconductor chip has at least two terminal pads, one of the two terminal pads of the integrated circuit semiconductor chip being electrically connected to one end of the lead frame coil structure, the two of the integrated circuit semiconductor chip One of the two terminal pads is electrically connected to the other end of the lead frame coil structure.
    According to another embodiment of the present invention, a method of combining an induction coil and an integrated circuit semiconductor chip in a single lead frame package comprises: providing a single package; Providing a lead frame located in a single package and having a coil structure and located in one horizontal plane; And providing at least one terminal pad located in a single package and coupled to the lead frame, the at least one terminal pad being electrically coupled to at least a portion of the coil structure of the lead frame.
    The above and other objects, features and advantages of the present invention will become apparent from the following detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings.
    Referring to FIG. 1, reference numeral 10 generally denotes a single lead frame package in which an induction coil and an integrated circuit semiconductor chip are coupled. The package 10 includes a plastic capsule cover 12 made of a plastic encapsulation type material used in a plastic capsule package. This plastic capsule lid 12 has a single metal to form a plurality of coil shaped lead frames at one time so as to be continuously separated into individual induction coil shaped lead frame elements as shown in FIG. 1, for example. Lead frame structure in the form of an induction coil or structure having three attached connecting members 16 cut from connecting members (not shown) of adjacent coil shaped lead frames (not shown) that are stamped during the stamping process. (14) is included. This connecting bar 16 functions to support the coil 14 and the die paddle described later on the same side. In the embodiment of FIG. 1, the induction coil 14 preferably consists of a copper alloy, such as the copper alloy known as CDA194. Preferably, the copper wire of induction coil 14 has a width of about 10 mm and the spacing between adjacent copper wires is preferably about 10 mm wide. In the embodiment of FIG. 1, the induction coil 14 is preferably flat and wound six times, but if desired, more or fewer coils may be used depending on the size or amount of electrical inductance desired. The length of the induction coil 14 is, for example, about 160 mm long. The actuation signal of the RF induction coil 14 has a frequency of 13.6 MHz, for example, and the width of the coil 14 ranges from about 2 inches to about 1 m.
    The die attach paddle or pad 18 is also part of the lead frame, but is not part of the induction coil 14, in which the die attach paddle or pad 18 is a pair of vertical connecting bar members 20 and horizontal connecting bar members. This is because it is separated from the induction coil 14 as shown in FIG. 1, which appears to be coupled to 22. The members 20, 22 are pre-coupled to the corresponding connecting bar members (not shown) of adjacent lead frame structures (not shown) before being separated as in the configuration shown in FIG. The integrated circuit semiconductor chip 24 is mounted and coupled to the die attach paddle 18 by a suitable adhesive, for example.
    In the embodiment of FIG. 1, the two terminal pads 26, 28 of the integrated circuit semiconductor chip 24 are each outside the induction coil 14 by means of electrically conductive wire bonds 34, 36. It is electrically connected to the side end 30 and the inner end 32. The chip 24 may be any type of integrated circuit semiconductor chip, but if the chip 24 is a transmitter type integrated circuit semiconductor chip, the chip antenna may have a transmit antenna having an RF signal of 13.6 MHz in the range of about 2 inches to about 1 meter. It is possible to transmit the electrical signal generated by the chip 24 by the induction coil 14, which serves. Similarly, if chip 24 is a receiver type integrated circuit semiconductor chip, it is possible to receive appropriate electrical signals by induction coil 14 acting as a receiving antenna. If desired, chip 24 may itself be a transmitter and receiver, optionally acting as a transmitter or receiver.
    2, reference numerals used in FIG. 1 to refer to the same elements are also used in FIG. 2. In the embodiment of FIG. 2, the induction coil 14 is wound four times instead of six times as in FIG. 1. In addition, the number of turns of the induction coil 14 may vary depending on the desired particular reason, such as the size or amount of inductance required for the induction coil 14. In addition, in the embodiment of FIG. 2, the integrated circuit semiconductor chip 24 is preferably located at the corner portion of the coil 14 adjacent to where the end portion 30 of the coil 14 is located. A dielectric type adhesive or epoxy is used to attach the chip 24 to the corner portion of the coil 14 located just below the chip 24. The use of a dielectric adhesive makes it possible to prevent the bottom portion of the chip 24 from electrically shorting across adjacent coil 14 portions. In the embodiment of FIG. 2, the wire bond 34 is an electrical contact between the terminal pad 26 of the chip 24 and the silver plated end 38 located at the end 30 of the induction coil 14. Let this be done. Similarly, wire bond 36 also allows electrical contact between the terminal pad 28 of integrated circuit chip 24 and the silver plated end 40 of the end portion 32 of the coil 14. The silver plated ends 38, 40 are formed by silver plating appropriate areas on the copper surface of the copper induction coil 14. The embodiment of FIG. 2 is more compact than the embodiment of FIG. 1, thus providing shorter electrically conductive paths and faster reaction times. In addition, the embodiment of FIG. 2 requires less lead frame material and is less expensive than the structure of the embodiment of FIG. One other important advantage of the Figures 1 and 2 embodiment is that the RF induction coils 14 of these two embodiments are made of the same material used to stamp lead frames for different packages. Another important advantage of the FIG. 2 embodiment is that more coils per area can be used, which, if desired, can substantially eliminate or reduce the intersection of wire bonds over the induction coil 14. The silver plated end 38 shown in FIG. 2 may also be used in the embodiment of FIG. 1 if desired. One other important advantage of FIGS. 1 and 2 is that, if desired, no external leads are provided outside of the package of FIGS. 1 and 2, and an antenna (induction coil 14) is provided to the electrical signal into the package of FIG. 1 or 2. It can also be used alone to provide a, and also, if desired, to be able to obtain an electronic signal from the package of Figs.
    Although the invention has been shown and described with respect to particularly preferred embodiments, it will be apparent to those skilled in the art that the foregoing and other modifications in form and detail may be made without departing from the spirit and scope of the invention. There will be.
    权利要求:
    Claims (40)
    [1" claim-type="Currently amended] A single lead frame package having a coupling induction coil and an integrated circuit semiconductor chip,
    With a single package;
    A lead frame located in the single package and having a coil structure and positioned in one horizontal plane; And
    And an integrated circuit semiconductor chip located in a single package and coupled to the lead frame and having at least one terminal pad electrically coupled to at least a portion of the coil structure of the lead frame.
    [2" claim-type="Currently amended] 2. The integrated circuit semiconductor chip of claim 1, wherein the integrated circuit semiconductor chip has at least two terminal pads, one of the two terminal pads of the integrated circuit semiconductor chip being electrically connected to one end of the lead frame coil structure, And the other one of said two terminal pads of said integrated circuit semiconductor chip is electrically connected to the other end of said lead frame coil structure.
    [3" claim-type="Currently amended] 3. The integrated circuit semiconductor chip of claim 2, wherein both of the two terminal pads of the integrated circuit semiconductor chip are located on an upper surface of the integrated circuit semiconductor chip, and a bottom surface portion of the integrated circuit semiconductor chip is coupled to the lead frame. Single lead frame package.
    [4" claim-type="Currently amended] 4. The single lead frame package of claim 3, wherein the single package is a plastic capsule single package.
    [5" claim-type="Currently amended] 2. The single lead frame package of claim 1, wherein the coil structure of the lead frame is a substantially flat coil structure.
    [6" claim-type="Currently amended] 6. The single lead frame package of claim 5, wherein the coil structure of the lead frame is a coil of copper alloy.
    [7" claim-type="Currently amended] 7. The lead frame package of claim 6, wherein the copper alloy is a CDA194 copper alloy.
    [8" claim-type="Currently amended] 7. The single lead frame package of claim 6, wherein the copper coil has two ends, each having a silver filled end.
    [9" claim-type="Currently amended] 9. The single lead frame package of claim 8, wherein the silver filled end is a spot silver plated tip portion above each of the two ends of the copper coil.
    [10" claim-type="Currently amended] 3. The coil structure of claim 2, wherein the coil structure of the lead frame is a substantially flat coil structure, the coil structure of the lead frame is a coil of a copper alloy, and the copper coil has two ends. The two ends have a silver filled end, one of the two terminal pads of the integrated circuit semiconductor chip is electrically connected to a silver filled end located at one of the two ends of the copper coil, And the other one of said two terminal pads of said integrated circuit semiconductor chip is electrically connected to a silver-filled end located at the other of said two ends of said copper coil.
    [11" claim-type="Currently amended] 2. The single lead frame package of claim 1, wherein the integrated circuit semiconductor chip is a transmitter and the coil structure of the lead frame is a transmit antenna for the transmitter.
    [12" claim-type="Currently amended] 2. The single lead frame package of claim 1, wherein the integrated circuit semiconductor chip is a receiver and the coil structure of the lead frame is a receive antenna for the receiver.
    [13" claim-type="Currently amended] The single lead frame package of claim 1, wherein the integrated circuit semiconductor chip is positioned substantially over a corner region of the coil structure of the lead frame.
    [14" claim-type="Currently amended] The single lead frame package of claim 1, wherein the integrated circuit semiconductor chip is positioned adjacent to one side portion of the coil structure of the lead frame.
    [15" claim-type="Currently amended] The semiconductor device of claim 13, wherein the integrated circuit semiconductor chip has at least two terminal pads, one of the two terminal pads electrically connected to one end of the coil structure of the lead frame, and the two terminals. The other one of the pads is electrically connected to the other end of the coil structure of the lead frame.
    [16" claim-type="Currently amended] The semiconductor device of claim 15, wherein the one end of the coil structure of the lead frame is located adjacent to one side of the integrated circuit semiconductor chip, and the other part of the coil structure of the lead frame is the integrated circuit semiconductor. A single lead frame package characterized by being located adjacent to the other side of the chip.
    [17" claim-type="Currently amended] The semiconductor device of claim 14, wherein the integrated circuit semiconductor chip has at least two terminal pads, one of the two terminal pads being electrically connected to one end of the coil structure of the lead frame, and the two terminals. The other of the pads is electrically connected to the other end of the coil structure of the lead frame, and the one end of the coil structure of the lead frame is the coil of the lead frame away from the integrated circuit semiconductor chip. A single lead frame package, positioned in a central portion of the structure, wherein the other portion of the coil structure of the lead frame is adjacent to one side portion of the integrated circuit semiconductor chip.
    [18" claim-type="Currently amended] 18. The single lead of claim 17, wherein the integrated circuit semiconductor chip is positioned and attached to a portion of the lead frame that has a substantially rectangular structure and is spaced apart from the other end of the coil structure of the lead frame. Frame package.
    [19" claim-type="Currently amended] 16. The integrated circuit of claim 15, wherein the one end of the coil structure of the lead frame is located at the center of the coil structure of the lead frame, and the other end of the coil structure of the lead frame is the integrated circuit. A single lead frame package, which extends past the bottom of a semiconductor chip.
    [20" claim-type="Currently amended] 20. The single lead frame package of claim 19, wherein the integrated circuit semiconductor chip is insulated from and attached to the central region of the coil structure of the lead frame.
    [21" claim-type="Currently amended] A method of combining an induction coil and an integrated circuit semiconductor chip in a single lead frame package,
    Providing a single package;
    Providing a lead frame located in the single package and having a coil structure and located in one horizontal plane; And
    Providing an integrated circuit semiconductor chip located in the single package and having at least one terminal pad coupled to the lead frame and electrically coupled to at least a portion of the coil structure of the lead frame. A method of combining an induction coil and an integrated circuit semiconductor chip in a single lead frame package.
    [22" claim-type="Currently amended] 22. The integrated circuit semiconductor chip of claim 21, wherein the integrated circuit semiconductor chip has at least two terminal pads, one of the two terminal pads of the integrated circuit semiconductor chip electrically connected to one end of the coil structure of the lead frame. And another one of said two terminal pads of said integrated circuit semiconductor chip is electrically connected to the other end of said coil structure of said lead frame.
    [23" claim-type="Currently amended] 23. The device of claim 22, wherein both of the two terminal pads of the integrated circuit semiconductor chip are located on an upper surface of the integrated circuit semiconductor chip, and a bottom surface portion of the integrated circuit semiconductor chip is coupled to the lead frame portion. How to.
    [24" claim-type="Currently amended] The method of claim 23, wherein the single package is a plastic capsule single package.
    [25" claim-type="Currently amended] 22. The method of claim 21 wherein the coil structure of the lead frame is a substantially flat coil structure.
    [26" claim-type="Currently amended] 27. The method of claim 25, wherein the coil structure of the lead frame is a coil of copper alloy.
    [27" claim-type="Currently amended] 27. The method of claim 26, wherein the copper alloy is a CDA194 copper alloy.
    [28" claim-type="Currently amended] 27. The method of claim 26, wherein the copper coil has two ends, each having a silver filled end.
    [29" claim-type="Currently amended] 29. The method of claim 28, wherein the silver filled end is a point silver plated end on each of the two ends of the copper coil.
    [30" claim-type="Currently amended] 23. The coil structure of claim 22, wherein the coil structure of the lead frame is a substantially flat coil structure, the coil structure of the lead frame is a coil of copper alloy, the copper coil has two ends, and each of The two ends have a silver filled end, one of the two terminal pads of the integrated circuit semiconductor chip is electrically connected to a silver filled end located at one of the two ends of the copper coil, And the other of said two terminal pads of said integrated circuit semiconductor chip is electrically connected to a silver-filled end located at the other of said two ends of said copper coil.
    [31" claim-type="Currently amended] 22. The method of claim 21 wherein the integrated circuit semiconductor chip is a transmitter and the coil structure of the lead frame is a transmit antenna for the transmitter.
    [32" claim-type="Currently amended] 22. The method of claim 21, wherein the integrated circuit semiconductor chip is a receiver and the coil structure of the lead frame is a receive antenna for the receiver.
    [33" claim-type="Currently amended] 22. The method of claim 21, wherein the integrated circuit semiconductor chip is substantially positioned over a corner region of the coil structure of the lead frame.
    [34" claim-type="Currently amended] 22. The method of claim 21 wherein the integrated circuit semiconductor chip is located adjacent one side portion of the coil structure of the lead frame.
    [35" claim-type="Currently amended] 24. The semiconductor device of claim 23, wherein the integrated circuit semiconductor chip has at least two terminal pads, one of the two terminal pads being electrically connected to one end of the coil structure of the lead frame, and the two terminal pads. The other of which is electrically connected to the other end of the coil structure of the lead frame.
    [36" claim-type="Currently amended] 36. The device of claim 35, wherein the one end of the coil structure of the lead frame is located adjacent one side of the integrated circuit semiconductor chip, and the other end of the coil structure of the lead frame is And located adjacent to the other side of the integrated circuit semiconductor chip.
    [37" claim-type="Currently amended] 35. The integrated circuit semiconductor chip of claim 34, wherein the integrated circuit semiconductor chip has at least two terminal pads, one of the two terminal pads being electrically connected to one end of the coil structure of the lead frame, wherein the two terminals The other of the pads is electrically connected to the other end of the coil structure of the lead frame, and the one end of the coil structure of the lead frame is the coil of the lead frame away from the integrated circuit semiconductor chip. Located in a central portion of the structure, wherein the other portion of the coil structure of the lead frame is located adjacent one side portion of the integrated circuit semiconductor chip.
    [38" claim-type="Currently amended] 38. The method of claim 37, wherein the integrated circuit semiconductor chip is positioned and attached to the lead frame portion having a substantially rectangular structure and spaced apart from the other end of the coil structure of the lead frame.
    [39" claim-type="Currently amended] 36. The integrated circuit of claim 35, wherein the one end of the coil structure of the lead frame is located at a central portion of the coil structure of the lead frame, and the other end of the coil structure of the lead frame is the integrated circuit. And extending past the bottom of the semiconductor chip.
    [40" claim-type="Currently amended] 40. The method of claim 39, wherein the integrated circuit semiconductor chip is insulated from and attached to the central region of the coil structure of the lead frame.
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    同族专利:
    公开号 | 公开日
    EP0902472A2|1999-03-17|
    US6180433B1|2001-01-30|
    EP0902472A3|2000-10-18|
    US5909050A|1999-06-01|
    JPH11154727A|1999-06-08|
    JP2000124388A|2000-04-28|
    TW408452B|2000-10-11|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-09-15|Priority to US8/929,579
    1997-09-15|Priority to US08/929,579
    1998-09-15|Application filed by 마이크로칩 테크날러쥐 인코포레이티드
    1999-04-26|Publication of KR19990029974A
    优先权:
    申请号 | 申请日 | 专利标题
    US8/929,579|1997-09-15|
    US08/929,579|US5909050A|1997-09-15|1997-09-15|Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor|
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